摘要
针对微型模具的结构和精度要求,在研究硅模具和背板生长两种工艺路线的基础上,提出了无背板生长工艺路线,并介绍了工艺路线中所涉及的三种MEMS加工方法,即UV-LIGA技术中的光刻、微电铸以及硅MEMS加工技术中的湿法刻蚀.实验结果表明,硅模具和背板生长模具呈54.74°的斜面,且硅模具容易损坏,背板生长模具受应力影响易产生变形;而无背板生长工艺能够获得侧壁垂直、表面细致、使用寿命长的模具,满足结构和精度要求。
Based on the researches of silicon mould and back board growing technics,the backless board growing technique is proposed for the demand of structure and precision in the article,and three MEMS techniques,i.e.lithography,microelectroforming in UV-LIGA and wet etching in silicon machining,are presented.The experimental results indicate that the walls of silicon mould and back board growing mould bevel at 54.74°,and silicon mould is easy to damage,and back board growing mould is inclined to be distorted for the influence of inter stresses.Whereas the backless board growing technics can attain moulds of vertical wall,smooth surface,longer using life,and satisfy the demand of structure and precision.
作者
肖日松
杜立群
刘冲
刘海军
秦江
Xiao Risong;Du Liqun;Liu Chong;Liu Haijun;Qin Jiang(Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116024;Research Center of Microsystems of Technology,Dalian University of Technology,Dalian 116024)
出处
《高技术通讯》
CAS
CSCD
北大核心
2006年第4期368-371,共4页
Chinese High Technology Letters
基金
863计划MEMS重大专项(2004AA404260)资助项目.
