摘要
金丝球焊是电子工业中应用最广泛的引线键合技术,但随着高密度封装的发展,铜丝球焊日益引起人们的关注。采用热压超声键合的方法,分别实现Au引线和Cu引线键合到Al-1%Si-0.5%Cu金属化焊盘。对焊点进行200℃老化实验的结果表明:铜丝球焊焊点的金属间化合物生长速率比金丝球焊焊点慢的多;铜丝球焊焊点具有比金丝球焊焊点更稳定的剪切断裂载荷,并且在一定的老化时间内铜丝球焊焊点表现出更好的力学性能;铜丝球焊焊点和金丝球焊焊点在老化后的失效模式不同。
Copper wire bonding is an alternative interconnection technology that serves as a viable and cost-saving alternative to gold wire bonding which is commonly applied in microelectronic packaging. The gold wire and copper wire were bonded to the Al＋1%Si＋0.5%Cu pad successfully by thermosonic wire bonding, respectively. Scanning Electron Microscopy （SEM） and Energy Dispersive X-ray / Spectrometer （EDX） were adopted to investigate the intermetaUic compound （IMC） at the interface of wire and pad; shear tests and pull tests were also performed on annealed samples to study the mechanics properties and failure modes of joint. The results show that the rate of Cu/Al IMC growth is much slower than that of Au/Al IMC; Copper joint has more stable ball shear strength compared to gold joint; The two joints have different failure modes during thermal aging.
出处
《电子工业专用设备》
2006年第5期23-27,共5页
Equipment for Electronic Products Manufacturing
