摘要
分析了热固性塑料的流动行为特点和IC封装充填过程中料流对金丝的冲击状态。用CAE软件Moldflow公司的MPA对流道的平衡进行分析模拟 ,优化浇注系统 ,为提高IC封装产品合格率寻找一种简便有效的途径。
The flow behavior characteristics of thermosetting plastics and the impact of plastic flow to gold wires in the course of filling for IC encapsulation are analyzed.The CAE software MPA of Moldflow Company has been used to conduct the analysis and simulation of the runner balance and the optimization of the runner system.It provides a simple and effective approach for increasing the ratio of up-to-grade IC encapsulating products.
出处
《模具工业》
北大核心
2004年第5期34-37,共4页
Die & Mould Industry
