摘要
讨论了电子软钎料的钎焊性能及其影响因素,并采用铺张面积法对Sn-Zn-Ag系钎料钎焊性能进行评估。钎料的钎焊性能很大程度上取决于钎料对基板的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面的界面张力有关。对润湿角(θ)与铺展面积(S)之间的关系进行了探讨。
The solderability of electronic solders and effect of some factor on the solder ability were discussed.And the test method of spreading areas was used to evaluate the solderability of the Sn-Zn-Ag family of solder.The solderability depends on a great extent on the wettability, which relates to solid,liquid and gas interfacial tensions of the melted solders on substrates.The relationship between the wetting angle (θ) and spreading areas (S) is researched.
出处
《电子工艺技术》
2003年第3期96-99,共4页
Electronics Process Technology
关键词
电子软钎料
钎焊性能
润湿角
铺展面积
Electronic solders
Solderability
Spreading areas
Wetting angle
