摘要
利用快速凝固技术制备出Cu-Ni-Sn-P快冷薄带钎料,将此钎料分别在不同钎焊温度和钎焊时间下与紫铜进行真空钎焊.借助DTA、EPMA的分析,探讨了在不同钎焊条件下钎焊接头的显微组织结构及同成分快冷钎料与普通钎料的润湿性差异.研究结果表明,与普通钎料相比快冷钎料润湿性明显提高,钎料与母材的相互扩散和冶金结合增强.
The brazing ribbons of Cu-Ni-Sn-P were prepared by means of rapid solidification technique. Microstructure and wettability of the joints brazed at different brazing temperature and holding time was analyzed by using DTA and EPMA. The results showed that the wettability of the brazing foils was improved greatly,and the interdiffusion and metallurgical combination between base metal and filler metals was enhanced.
出处
《兰州理工大学学报》
CAS
北大核心
2006年第2期18-20,共3页
Journal of Lanzhou University of Technology
基金
甘肃省自然科学基金(YS021-A22-017)
