摘要
本文比较详细地讨论了和Al有共晶反应的金属颗粒在Al表面的反应铺展的过程和实质,在此基础上对Al/Cu接触反应钎焊中的Al表面氧化膜行为和接头形成机制进行了研究和探讨。
The reactive spread behaviour of Cu particles on the surface of Alhas been studied. The role of oxide film and the formation mechanism of the jointduring Al/Cu contacting reaction brazing have been discussed.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
1989年第1期B042-B047,共6页
Acta Metallurgica Sinica
