摘要
微电子技术的飞速发展也推动了新型芯片封装技术的研究和开发。本文主要介绍了几种新型芯片封装技术的特点,并对未来的发展趋势及方向进行了初步分析。
The rapid development of microelectronictechnology has been giving impetus to the development ofnew chip package technology. Characteristics of severaladvanced chip package technology are introduced in thepaper. The up-to-date trends are discussed and the futureresearch directions are suggested.
出处
《信息技术与标准化》
2003年第10期38-41,共4页
Information Technology & Standardization
