摘要
BGA组装质量直接关系到电子产品的可靠性,在多品种小批量的工程实践中,BGA组装质量控制技术是提高BGA焊接的"首次成功率"的关键技术。分析影响BGA组装质量的各种因素,从新的角度提出适应于多品种小批量新的BGA组装质量控制技术,对多项关键技术进行研究,获得了优化的关键控制参数,完善了BGA组装质量控制流程,建立了BGA组装质量控制体系,以达到提高BGA焊接"首次成功率"的目的。
BGA assembly quality directly impacts the reliability of electronic product.BGA assembly quality control technology is the key that can improve ＂the first success rate＂ for BGA solder in engineering practice of low-volume but morevarieties products.Analyze the influnce factors on BGA assembly quality,and present new assembly quality control technology from a new point adapting to low-volume but more-varieties products.Omnibus key technology is researched and optimization control parameters are derived.BGA assembly quality control process is perfected and system is established.Finally,the purpose of ＂the first success rate＂ for BGA soldering is achieved by above measures.
出处
《电子工艺技术》
2013年第4期196-199,共4页
Electronics Process Technology
基金
"十二五"预先研究项目(项目编号:51318070116)
关键词
再流焊
首次成功率
控制技术
控制参数
控制流程
控制体系
Reflow soldering
First success rate
Control technology
Control parameter
Control process
Control system
