摘要
以电子封装为应用对象 ,通过合理选择一定粒径分布的SiC颗粒 ,采用挤压铸造方法制备了SiC颗粒体积分数分别为 5 0 % ,6 0 %和 70 %的 3种SiCp/Al复合材料。材料组织致密 ,颗粒分布均匀。复合材料的平均线热膨胀系数 (2 0～ 10 0℃ )随SiC含量的增加而降低 ,在 8.3× 10 -6～ 10 .8× 10 -6/℃之间 ,与Kerner模型预测值相符。复合材料比强度和比刚度高 。
SiC_p/Al composites with SiC_p volume fractions of 50%, 60% and 70% for electronic packaging applications were fabricated using squeeze casting technology. The composites appear to be free of pores, and the SiC particles distribute uniformly in the composites. The mean linear coefficient of thermal expansion (20～100 ℃) of SiC_p/Al composites ranges from (8.2×10^(-6)) to 10.8×10^(-6)/℃ and decreases with increasing SiC_p content. The measured coefficients of thermal expansion agree well with Kerners model. The composites show high specific bending strength and modulus. This can meet the technical requirements for electronic packaging.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2003年第5期1180-1183,共4页
The Chinese Journal of Nonferrous Metals
