摘要
采用挤压铸造法制备了SiC颗粒体积分数分别为50%、55%和60%的SiCp/Cu复合材料,并分析测试了体积分数和热处理状态对复合材料热膨胀性能的影响规律。显微组织观察表明:复合材料的组织致密,SiC颗粒分布均匀。热膨胀性能测试表明:铸态复合材料的平均线热膨胀系数(20～100℃)介于8.8～9.9×10-6/℃之间,且随SiC含量的增加而降低,实验值与Kerner模型预测值相符。退火处理可以减小基体中的热残余应力,有助于降低复合材料的热膨胀系数,退火态复合材料的热膨胀系数实验值与Turner模型预测值相符。
High reinforcement content SiCp/Cu composites （ Vp = 50%, 55% and 60%）were fabricated by squeeze casting technology. The microstructure and thermal expansion properties of the SiCp/Cu composites are investigated. Results show that the composites are free of porosity and SiC particles are distributed uniformly in the composite. The mean linear coefficients of thermal expansion （CTEs, 20 - 100℃ ） of as-cast SiCp/Cu composites range from 8.8 to 9.9 × 10^-6/℃ and decrease with the increasing of SiC content. The experimental CTEs of as-cast SiCp/Cu composites are in reasonable agreement with the predicted values based on Turner model. The CTEs of composites decrease after annealing treatment beacause of the release of internal stress of the composite, and the experimental CTEs of annealed SiCp/Cu composites are in good agreement with the predicted values based on Kerner model.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2009年第2期22-24,35,共4页
Transactions of Materials and Heat Treatment
基金
中国博士后科学基金资助项目(20080430895)
哈尔滨市科技创新人才研究专项资金项目(2008RFQXG045)
关键词
电子封装
SICP/CU复合材料
热膨胀系数
退火处理
electronic packaging
SiCp/Cu composites
coefficient of thermal expansion（CTE）
heat treatment
