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适用于阵列波导光栅制作的厚SiO_2陡直刻蚀技术 被引量:3

A Deep Vertical SiO_2 Etching Technique for AWG Fabrication
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摘要 采用 ICP- 98型高密度等离子体刻蚀机进行了厚 Si O2 陡直刻蚀技术的研究 ,利用双层掩膜技术解决了“微掩膜现象”问题 ,刻蚀获得 12 .4 μm的陡直 Si O2 光波导剖面 ,并将这一刻蚀技术用于阵列波导光栅的制作中 . Aarrayed waveguide grating(AWG) multiplexer is the key device among all the demulti/multiplexer.The difficulty in an AWG fabrication is deep vertical SiO 2 etching.Using ICP 98 high density plasma etcher,a deep vertical SiO 2 etching technology is demonstrated and is used to etch an AWG.The micro mask phenomenon is solved by using double mask technology.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第11期1222-1225,共4页 半导体学报(英文版)
关键词 阵列波导光栅(AWG) SiO2 感应耦合等离子体刻蚀(ICP) arrayed waveguide grating SiO 2 inductively coupled plasma etching
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参考文献10

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二级参考文献1

  • 1Li Y P,IEE Proc Optoelectron,1998年,143卷,5期,263—280页

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