摘要
介绍了选择性化学镀镍、浸金工艺的原理、流程和操作参数。该技术用于印刷线路板表面精饰,镀层平整、电阻小、锡焊性好、耐磨性强。
Mechanism, procedures and operation parameters of selective electroless nickel plating and gold immersion (SENi/IG) were introduced. SENi/IG technology was applied for PCB surface finishing. The deposit has good solderability, wear resistance, leveling appearance and small electric resistance.
出处
《电镀与涂饰》
CAS
CSCD
2003年第5期27-29,共3页
Electroplating & Finishing
关键词
化学镀镍
浸金
选择性
印刷线路板
electroless nickel plating
gold immersion
selective
PCB
