摘要
在前期开发的化学镀镍液主配方及单因素筛选试验基础上,使用硫脲衍生物M、Pb(Ac)2、CuSO4·5H2O、KI及羟基吡啶鎓盐(PPSOH)5种药品进行正交试验,优选出一种新型四元复合添加剂。使用该添加剂,不仅能获得高稳定性的镀液,而且能大大提高镍镀层的耐硝酸腐蚀性能,同时获得光亮、细致的外观;与不加添加剂相比,镀液氯化钯稳定性测试时间由21s延长到12h;镀层的耐硝酸测试时间由23s延长到404s;采用目测外观打分法评价镀层,外观光亮性由60.00提高到85.00。与某商品化添加剂相比,该四元复合添加剂对镀液、镀层性能的改善效果更为优异。
Based on previous work about the bath formulation and single factor screening test for electroless nickel plating of printed circuit board, sulfur-urea derivative M, KI, Pb(Ac)_2,CuSO_4·5H_2O, and hydroxyl pyridine onium salt were used for orthogonal test so as to screen a quaternion additive applicable to electroless nickel plating. The effects of the quaternion additive on the stability of the plating bath and the corrosion resistance and appearance of the nickel coating were investigated. It was found that the bath stability determined using Pd stability test was significantly increased from 21 s in the absence of the additive to 12 h in the presence of the additive. Moreover, the introduction of the additive contributed to improving the brightness and increasing the corrosion resistance of the electroless nickel coating in nitric acid. In particular, the developed additive was much superior to a commercial additive of the same type in terms of the ability to increase the bath stability and corrosion resistance of the Ni coating.
出处
《材料保护》
CAS
CSCD
北大核心
2006年第10期30-32,共3页
Materials Protection
关键词
印刷线路板
化学镀镍
添加剂
正交试验
耐腐蚀性能
printed circuit board
electroless nickel plating
additives
orthogonal test
corrosion resistance
