摘要
本文从化学增幅技术的产生,深紫外248nm胶主体树脂及PAG发展历程、溶解抑制剂、存在的工艺问题及解决途径多个方面综述了深紫外248nm胶的发展与进步.
Deep UV lithography operating at 248 nm with use of chemical amplification resists has finally become a production technology.This paper describes the evolution and progress of the deep UV 248 nm photoresists from aspects of birth of chemical amplification technology,evolution of deep UV 248 nm resists in matrix resins and PAG,dissolution inhibitor,processing problems and solutions of them.
出处
《感光科学与光化学》
SCIE
EI
CAS
CSCD
北大核心
2003年第5期346-356,共11页
Photographic Science and Photochemistry
关键词
化学增幅
KRF激光
深紫外光刻
248
nm光刻胶
主体树脂
酸催化
光致产酸剂
chemical amplification
KrF excimer laser
deep UV lithography
248 nm photoresists
matrix resins
acid-catalysis
photoacid generator
