摘要
主要研究了沉积时间、镀液温度、pH值、镀层厚度及主盐浓度对化学镀锡层孔隙率的影响。结果表明:镀层孔隙率随沉积时间和镀层厚度的增加而降低,随镀液温度的升高而增加;氯化亚锡质量浓度为20g/L时,孔隙率最高;pH值为1.3～2.8时,孔隙率变化不大。
Effects of plating time, bath temperature, pH value, thickness of coatings and SnCl2 concentration on porosity of tin coatings were studied. Results show that the porosity is decreased with the increase in plating time and thickness of the coating, and is increased as the bath temperature rises. The porosity is the highest when the concentration of stannous chloride is at 20 g/L, and changes little when pH value of the bath is between 1.3 and 2.8.
出处
《电镀与精饰》
CAS
2003年第2期27-29,共3页
Plating & Finishing
关键词
镀层
化学镀锡
孔隙率
研究
electroless plating
tin coatings
porosity
