摘要
主要研究了氯化物法化学镀锡过程中次亚磷酸钠浓度、氯化亚锡浓度、温度、pH值、镀层厚度及热处理等因素对高锡镀层可焊性的影响 ,并用镀片所需的最短润湿时间测试了镀层的可焊性。实验结果表明 :在最佳工艺条件下 ,获得的高锡镀层可焊性能好 ,易焊接 ,在电子工业等领域中应用广泛。
In the electroless tin process by means of chlorid method,effect of the such factors on solderability of coating with high tin content is studied,as SnCl 2·H 2O concentration,Na 2H 2PO 2 concentration,temperature,pH value,thickness,plating time and heat treatment.The solderability of coating is tested by the shortest wetting time.The experimental results show that the solderability of tin coating is excellent and easy to weld under the optimum process conditions,and it is used widely in the electronic industry.
出处
《电子工艺技术》
2002年第3期98-100,共3页
Electronics Process Technology
