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电镀可焊性Sn-3.0Ag合金镀层影响因素的研究 被引量:4

Study on electroplating processes of solderable coatings from Methanesulfonate Bath
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摘要 研究了甲基磺酸盐体系电镀Sn 3 0Ag合金时 ,镀液成分和镀覆条件对锡银合金镀层中银含量以及阴极极化的影响 ,结果表明 ,镀层中银含量随镀液中银含量的增加、镀液 pH值的降低、光亮剂浓度的增加和阴极电流密度的降低而增加 ,柠檬酸钠和 2 ,3,4 三甲氧基苯甲醛对单金属锡。 Electroplating bath for a new solderable coating SnAg (Ag 3? % )alloy with low Ag composition was studied. Methanesulfonate of tin and silver were determined as main salts. Sodium citrate, potassium iodide and triethanolamine were used as chelating agents. Effects of every composition in bath and plating condition on coating qualities were researched. It has been found, by examinations on solderability and antioxygenation ability at high tmperature, that tin silver alloy coating has advantage over tin lead alloy coating, and fitted for industry, because of its stableness and non poisonous character.
作者 于海燕 王兵
出处 《沈阳工业大学学报》 EI CAS 2002年第6期534-537,共4页 Journal of Shenyang University of Technology
关键词 电镀 可焊性镀层 Sn-3.0Ag合金 可焊性镀层 锡银合金 镀液成分 镀覆条件 electroplating Sn Ag alloy solderability
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