摘要
研究了镁及镁合金的化学镀Ni Cu P三元合金工艺,通过正交试验获得了最佳的镀覆条件。并对镀层的组织结构及其性能进行了测试,所得的Ni Cu P三元非晶态镀层结合力好,具有良好的导电性和耐蚀性能。
Electroless plating of Ni-Cu-P ternary alloy on magnesium and its alloys was studied. Optimal process parameters were obtained by orthogonal test. The structure and properties of the Ni-Cu-P deposit were determined. The deposit is amorphous and has good adhesion, conductivity and corrosion resistance.
出处
《电镀与涂饰》
CAS
CSCD
2004年第3期6-8,共3页
Electroplating & Finishing
关键词
镁
镁合金
化学镀
NI-CU-P
magnesium
magnesium alloy
electroless plating
Ni-Cu-P
