摘要
气密性连接器因结构特性、焊接温度梯度的原因,一旦失效将直接造成微波组件报废处理。主要针对大尺寸铝合金组件用气密电连接器在封焊及试验中出现的气密失效问题,从材料特性、焊缝结构等方面对受力情况进行分析,并结合有限元分析模型仿真进行验证,从而探寻气密失效的主要原因和机理。通过仿真验证和方案实施,总结提炼大尺寸铝合金组件用气密连接器焊接的改进方案。结果表明:采用补偿垫环可在一定程度上实现梯度应力缓降,大大降低因热匹配不良带来的气密失效问题,并对其他微波组件用异质合金焊接提供参考。
Due to the structure characters and the thermal deformation,the failure of the hermetic connector directly leads to the scrapping and disposal of microwave components.For this present work mainly aiming at the hermetic connector failure problems for the large-size aluminum alloy module package during soldering and testing,through comparing the materials characters and soldering structure,and using the fi nite element analysis,the major reason and mechanism on the crack are explored.The optimum way to improve the soldering is investigated by simulation and experiments.The results show that the adoption of transition loop can to a certain extent achieve gradient stress mitigation,signifi cantly reduce the problem of airtight failure caused by poor thermal matching,which provides a reference for the soldering of heterogeneous alloys in other microwave components.
作者
陈柳
吴世国
陈晓峰
CHEN Liu;WU Shiguo;CHEN Xiaofeng(Shanghai Aerospace electronics Co.,Ltd.,Shanghai 201821,China)
出处
《电子工艺技术》
2026年第2期38-41,共4页
Electronics Process Technology
关键词
铝合金组件
气密焊接
应力分析
可靠性设计
aluminum alloy package
hermetic soldering
stress analysis
reliability design
