摘要
铝合金是微波组件封装的优选材料,微距形连接器是高密度电子封装中的关键元器件。但是由于铝合金与柯伐外壳的微距形连接器之间存在严重热失配,导致封装不具备长期气密性。针对此问题,设计了四种集成微矩形连接器的铝合金封装方案,通过有限元分析、仿真分析和试验验证,制定了最佳的封装方案。
Aluminum Alloy is the preferred material for microwave module packaging,while micro-rectangular connector is the key component for high density packaging.However,due to the thermal expansion mismatch between the aluminum alloy and the connectors with Kovar shell,the package does not have long-term air tightness.In order to solve this problem,four kinds of aluminum alloy packaging schemes with micro-rectangular connectors are designed.By using finite element analysis,simulation analysis and experimental verification,the optimal packaging scheme is developed.
作者
卢茜
李阳阳
张剑
董东
景飞
高阳
曾元祁
LU Qian;LI Yangyang;ZHANG Jian;DONG Dong;JING Fei;GAO Yang;ZENG Yuanqi(The 29th Research Institute of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2021年第2期66-69,共4页
Electronics Process Technology
基金
十三五技术基础科研项目(JSZL2018210B009)。
关键词
微矩形连接器
铝合金封装
气密
有限元分析
micro-rectangular connector
aluminum alloy packaging
hermetic
finite element analysis
