摘要
针对微波组件的关键误差源——金丝键合偏差进行研究,通过实验和仿真的方法,确定其对微波组件电性能的影响。结果表明,金丝的键合距离与拱高的增加都会导致传输损耗的增加,驻波比增大,S21减小。
The key error source of microwave components,gold wire pressure bonding deviation,is studied,and its influence on the electrical properties of microwave components is determined through the methods of experiment and simulation.The results show that the increase of bonding distance and arch height of gold wire will lead to the increase of transmission loss,the increase of standing wave ratio and the decrease of S21.
作者
张阳阳
胡子翔
王梅
ZHANG Yangyang;HU Zixiang;WANG Mei(National Industrial Design Center,The 38th Research Institute of CETC,Hefei 230031,China)
出处
《电子工艺技术》
2020年第4期196-199,共4页
Electronics Process Technology
基金
基础科研资助项目(JCKY2016210B002)。
关键词
微波组件
金丝键合
电性能
有限元仿真
microwave component
Au wire bonding
electrical property
finite element simulation
