摘要
为解决400 G光模块印制电路板开发中包括Ⅱ阶高密度互连加工、阻抗精度控制、键合盘线顶宽度控制等技术难点,本文提出了一套系统解决方案:采用优化叠层结构与孔径设计,将通孔拆分为“激光盲孔+埋孔+激光盲孔”的复合结构进行加工,运用专业软件对差分对传输线进行精确阻抗模拟与仿真,并在生产过程中对减铜均匀性、树脂塞孔凹陷、电镀铜厚及键合盘蚀刻等重要序实施严格管控。结果表明,最终开发成功的400 G光模块PCB产品,其阻抗误差不超过±10%、键合盘线顶宽度不低于80μm,其可为高速、高密度光模块印制线路板的批量生产提供技术基础支撑及制备经验。
Presents a systematic solution to the key technical challenges in the development of 400G optical module printed circuit boards(PCBs),including the processing of second-order high-density interconnects,impedance accuracy control,and the control of the width of the bonding pad top.By optimizing the stack-up structure and hole diameter design,through holes are processed as a composite structure of"laser blind holes+buried holes+laser blind holes".Professional software is used to precisely simulate and model the differential pair transmission lines for impedance.During the production process,strict control is implemented over important processes such as the uniformity of copper reduction,resin filling hole depression,electroplating copper thickness,and bonding pad etching.Ultimately,a 400G optical module PCB product with an impedance error of no more than±10%and a bonding pad top width of no less than 80μm was successfully developed.This has laid a solid technical foundation and accumulated valuable preparation experience for the mass production of high-speed and high-density optical module printed circuit boards of this type.
作者
胡萍
李超谋
关志锋
刘江
黄德业
荀宗献
HU Ping;LI Chaomou;GUAN Zhifeng;LIU Jiang;HUANG Deye;XUN Zongxian(GCI Science&Technology(Zhuhai)Co.,Ltd.,Zhuhai 519170,Guangdong,China;GCI Electronic&Technology(Guangzhou)Co.,Ltd.,Guangzhou 510400,Guangdong,China)
出处
《印制电路信息》
2025年第12期30-34,共5页
Printed Circuit Information
关键词
400
G光模块板
设计优化
阻抗控制
400 G optical module printed circuit board
design optimization
impedance control
