摘要
为满足终端电子产品多功能及高性能的需求,印制电路板产品趋向结构高集成度、线路超精细化及信号高频高速化方向发展。以下阐述任意层高密度互连(HDI)芯层激光微导通盲孔的关键技术,根据芯层X型盲孔(X-VIA)制作原理,通过实验设计(DOE)抓取激光参数,并针对不同加工方法评价盲孔正/反(C/S)面错位的影响程度,选取最佳的激光参数,解决制作过程出现的孔小、连接宽面不足和错位等问题,提升微导通盲孔制作的可靠性。
In order to meet the multifunctional and high-performance needs of terminal electronic products,printed circuit board products tend to structure of high integration,line ultra-fine and signal high-frequency high-speed direction of development.This paper focuses on the key technology of laser micro-conductive blind holes in core layer of Anylayer products.According to the principle of making blind holes in Core layer X-VIA,we select the best laser parameters by capturing the DOE laser parameters and evaluating the degree of influence of misalignment of C/S surface of the blind holes in accordance with different processing methods,so as to solve the problems of small holes,insufficient connecting width and misalignment that occur in the production process and improve the reliability of micro-conductive blind hole production.The reliability of blind hole fabrication.
作者
黄武鹏
宾崇艺
陈芝远
侯得宗
HUANG Wupeng;BIN Chongyi;CHEN Zhiyuan;HOU Dezong(Zhuhai Founder Technology Hi-Density Electronic Co.,Ltd.,Zhuhai 519179,Guangdong,China)
出处
《印制电路信息》
2025年第8期47-54,共8页
Printed Circuit Information
关键词
激光盲孔
实验设计
C/S面错位
盲孔可靠性
laser blind hole
DOE
C/S surface misalignment
blind hole reliability
