摘要
封装气密性直接决定着MEMS惯性器件的长期稳定性和寿命。从封装形式来看,相比器件级封装,晶圆级封装具有尺寸小、成本低、封装良率高等特点,已经成为MEMS惯性器件的主流封装形式。介绍了MEMS惯性器件晶圆级封装气密可靠性评价领域的研究进展,包括参数测量和寿命预测方法。针对气密封装关键参数的测量方法——漏率测量、压力测量和气体成分分析,详细介绍了其发展现状并做了优缺点比较。最后,对MEMS惯性器件寿命预测的方法进行了讨论。
The hermeticity of packaging directly determines the long-term stability and lifespan of MEMS inertial devices.In terms of packaging forms,wafer-level packaging WLP has become the mainstream packaging approach for MEMS inertial devices due to its advantages such as compact size,low cost,and high packaging yield compared to device-level packaging.In this paper,recent research progress in hermeticity reliability evaluation for wafer-level packaging of MEMS inertial devices is reviewed,covering parameter measurement and lifespan prediction methods.For key hermetic packaging parameters—including leak rate measurement,internal pressure measurement,and gas composition analysis,their current development status is elaborated in detail,followed by a comparative analysis of their strengths and weaknesses.Finally,methods for predicting the lifespan of MEMS inertial devices are discussed.
作者
张程钢
赵前程
崔健
ZHANG Chenggang;ZHAO Qiancheng;CUI Jian(School of Integrated Circuits,Peking University,Beijing 100871;National Key Laboratory of Advanced Micro and Nano Manufacture Technology,Beijing 100871)
出处
《导航与控制》
2025年第3期51-64,共14页
Navigation and Control
基金
国家重点研发计划(编号:2023YFB3211200)。
关键词
MEMS惯性器件
晶圆级封装
气密可靠性
MEMS inertial devices
wafer-level packaging
hermeticity reliability
