摘要
极度微型化的微/纳真空器件要求专门的封装技术。论文综述了适用于微/纳真空器件封装的真空键合和电极互连技术,同时系统分析了一些相关技术,包括实现真空获得与维持的微型、可集成真空泵技术和非蒸散、薄膜吸气剂技术,监测器件工作环境的真空度测量技术,以及检测器件封装的真空检漏技术等。分析结果对微/纳真空器件的设计与工艺实现提供了有益参考。
Extremely miniaturized vacuum micro/nano devices require for specific packaging technologies.Vacuum bonding and electrode interconnection for vacuum micro/nano devices packaging are reviewed.Some relative technologies are also systematically analyzed,including integrated miniature vacuum pumps and nonevaporable getter films for vacuum acquisition and maintaining,vacuum measurements for operating ambient monitoring,vacuum leakage detection for packaging inspection,etc.The analysis is beneficial for the design and process realization of vacuum micro/nano devices.
作者
李兴辉
韩攀阳
杜婷
蔡军
冯进军
LI Xing-hui;HAN Pan-yang;DU Ting;CAI Jun;FENG Jin-jun(National Key Laboratory of Science and Technology on Vacuum Electronics,Beijing Vacuum Electronics Research Institute,Beijing 100015,China)
出处
《真空电子技术》
2022年第6期14-22,共9页
Vacuum Electronics
基金
国家自然科学基金项目(61831001)。
关键词
微/纳真空器件
封装
键合
互连
真空泵
吸气剂
Vacuum micro/nano devices
Packaging
Bonding
Interconnection
Vacuum pump
Getter
