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高性能横向轴硅微陀螺仪研究

Research on High-Performance Lateral-Axis Silicon Micromachined Gyroscope
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摘要 设计并制备了一种高性能横向轴硅微陀螺仪。阐述了横向轴硅微陀螺仪的研究现状及性能较差的原因。在此基础上,采用全封闭式驱动框架结构和四质量块全差分电容检测结构对陀螺仪敏感结构进行了优化,通过抑制正交误差、提高驱动能力、提升检测灵敏度、提高工作模态频率并隔离干扰模态频率,显著提升了陀螺仪的整体性能和环境适应性。采用表面硅微机械加工技术完成了陀螺仪芯片加工,利用无引脚芯片载体(LCC)实现了陀螺仪的气密封装。封装后陀螺仪整体尺寸为5.0 mm×5.0 mm×1.8 mm,功耗约为22 mW。测试了陀螺仪典型性能参数,陀螺仪量程达到±300°/s,零偏不稳定性为0.55°/h,角度随机游走为0.07°/h,能够满足大部分工程应用需求。 A high-performance lateral-axis silicon micromachined gyroscope was designed and fabricated.The current research status and reasons for the poor performance of lateral-axis silicon micromachined gyroscope were discussed.On this basis,the sensitive structure of the gyroscope was optimized by adopting a fully enclosed driving frame structure and a four-mass fully differential capacitive detection structure.By suppressing quadrature coupling error,enhancing driving capability,improving detection sensitivity,increasing the working mode frequencies,and isolating interference mode frequencies,the overall performance and environmental adaptability of the gyroscope are significantly improved.The gyroscope chip was fabricated by surface silicon micromachining technology and the gyroscope was hermetically packaged using a leadless chip carrier(LCC).After packaging,the overall size of the gyroscope is 5.0 mm×5.0 mm×1.8 mm,with a power consumption of about 22 mW.The typical performance parameters of the gyroscope were tested.The rang reaches±300°/s,the zero bias instability is 0.55°/h,the angle rand walk is 0.07°/h,which can meet most engineering application requirements.
作者 张志勇 杨拥军 任臣 Zhang Zhiyong;Yang Yongjun;Ren Chen(The 13th Research Institute,CETC,Shijiazhuang 050051,China)
出处 《微纳电子技术》 2025年第9期81-88,共8页 Micronanoelectronic Technology
关键词 微电子机械系统(MEMS) 振动式陀螺仪 四质量块 全差分电容检测 有限元仿真 micro-electromechanical system(MEMS) vibratory gyroscope four-mass fully differential capacitive detection finite element simulation
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