摘要
随着电力电子器件材料的发展,第三代宽禁带半导体(如SiC和GaN)因其优越的性能而成为功率器件的理想材料。然而,面对大功率和高温应用的挑战,传统的锡基封装材料已经难以满足需求,为此,研究者们开始关注可以低温烧结、高温服役的纳米烧结浆料。这些微米、纳米级的铜、银等浆料可以在远低于金属熔点的温度下烧结成具备高熔点、高导热、高性能的焊点结构。从烧结材料、烧结工艺、烧结机理3个方面讨论了近年来用于功率器件封装的烧结浆料的研究进展,具体包括纳米银、纳米铜、铜银复合和其他纳米级烧结材料,以及它们适配的热压烧结、无压烧结、薄膜烧结等工艺,为烧结浆料的进一步发展提供参考。
With the development of materials for power electronic devices,third-generation wide-bandgap semiconductors(such as SiC and GaN)have emerged as ideal materials for power devices due to their remarkable performance.However,facing the challenges of high-power and high-temperature applications,traditional tin-based packaging materials have difficulties in meeting the requirements of high-power and high-temperature applications.As a result,researchers have begun to focus on nanosintered pastes that can be sintered at low temperatures and serve at high temperatures.These micro-and nano-scale copper and silver pastes can be sintered at temperatures well below the melting point of the metal to form solder joint structures with a high melting point,high thermal conductivity,and high performance.The research progress of sintered pastes for power device packaging in recent years is discussed from three aspects:sintering materials,sintering process,and sintering mechanism,specifically including nano Ag,nano Cu,Ag-Cu composites,and other nano-sized sintering materials,as well as their corresponding processes such as thermal pressure sintering,pressureless sintering,and thin-film sintering techniques,in order to provide references for the further development of sintering pastes.
作者
王一平
于铭涵
王润泽
佟子睿
冯佳运
田艳红
WANG Yiping;YU Minghan;WANG Runze;TONG Zirui;FENG Jiayun;TIAN Yanhong(State Key Laboratory of Precision Welding&Joining of Materials and Structures,Harbin Institute of Technology,Harbin 150001,China;Zhengzhou Research Institute,Harbin Institute of Technology,Zhengzhou 450000,China)
出处
《电子与封装》
2025年第3期60-77,共18页
Electronics & Packaging
基金
国家自然科学基金(52205352)
国家自然科学基金联合基金-“叶企孙”科学基金(U2241223)。
关键词
纳米浆料
烧结
功率器件
电子封装技术
烧结纳米铜
nano paste
sinter
power device
electronics packaging technology
sinter nano Cu
