摘要
针对陶瓷封装声表面波(SAW)滤波器焊盘除金问题,提出了载板搪锡工艺的解决方案。通过制作外扩焊盘的搪锡载板进行滤波器批量贴装,在加热台上进行回流以溶解焊盘镀金层,取下上锡器件后用真空吸锡枪吸去焊盘表面焊锡,即可达到除金目的。详细介绍了搪锡载板的焊盘设计,利用红外测温仪对操作过程进行监控,对除金后的器件进行焊盘表面、焊点界面分析以及环境试验验证。试验表明,焊盘表面镀金层被完全去除,除金后的器件具有较高的可靠性。
The paper presents a tin-plating solution to remove gold using a carrier board for ceramic packaged SAW filters.Batch mounting of filters can be achieved using a tin-plating carrier board with external expansion solder pads.Meanwhile,reflow is performed on the heating table to dissolve the gold layer of the filter pad.After removing the tin-plating filter,the solder on the surface of the pads is suctioned off using a vacuum tin gun to remove the gold.A detailed introduction to the solder-pad design of the carrier board is provided herein.The abovementioned operation is monitored using an infrared thermometer.After gold removal,the device is analyzed based on the pad surface and solder joint interface.Subsequently,verification via an environmental test is performed to confirm that the gold plating layer on the solder pad surface is completely removed and that the device demonstrates high reliability.The results provide a reference for the design of the gold-removal process for ceramic sealed devices.
作者
唐盘良
李亚飞
黄莹
张钧翀
冷俊林
马晋毅
TANG Panliang;LI Yafei;HUANG Ying;ZHANG Junchong;LENG Junlin;MA Jinyi(University of Electronic Science and Technology of China,School of Integrated Circuit Science and Engineering,Chengdu 611731,China;The 26th Institute of China Electronics Technology Group Corporation,Chongqing 400060,China)
出处
《压电与声光》
CAS
北大核心
2024年第5期695-699,共5页
Piezoelectrics & Acoustooptics
