摘要
目前主流的终端用射频声表面波(RF-SAW)滤波器均采用基于低温共烧陶瓷(LTCC)基板的倒装焊接技术,标准尺寸为单滤波器1.4mm×1.1mm,封装形式为芯片尺寸级封装(CSP)。介绍了一种基于印刷电路板(PCB)的CSP封装声表面波滤波器,其尺寸达到了1.4mm×1.1mm。使用该基板后,单个器件的材料成本将降低30%以上。通过优化基板的结构,可以达到与LiTaO3匹配的热膨胀系数(CTE)和较低的吸湿性。经后期的可靠性试验证明,该结构的射频滤波器可完全满足工程应用的需求。
The mainstream packaging for RF-SAW filters in the terminals are mainly used the flip chip technolo- gy based on LTCC ceramic board. The packaged standard size is 1.4 minx 1.1 mm for single SAW filter CSP. This paper introduces a CSP SAW filter based on multilayer print circuit board （PCB）, and the size goes down to 1.4 mm × 1.1 mm. With the usage of PCB board, the cost of single device will be cut more than 30%. Through optimizing the board structure, the coefficient of thermal expansion （CTE） of PCB board can match with that of its counterpart LiTaOa and the moisture absorption is low. The post^reliability test result shows that the RF-SAW filter with the proposed structure can meet the requirements of engineering applications.
出处
《压电与声光》
CSCD
北大核心
2013年第2期155-157,161,共4页
Piezoelectrics & Acoustooptics
基金
重庆市国际科技合作基地基金资助项目(cstc2011gjh240001)
