摘要
使用烧结银膏作为封装互连材料可以充分发挥宽禁带半导体在器件应用上的优势,并提高器件的可靠性。通过对无压银膏烧结焊点的微观组织、力学性能和失效模式进行分析,系统地研究了无压银膏烧结焊点在不同温度下的组织演变规律,获得了烧结温度、基板金属化类型对烧结银连接性能和可靠性的影响。当烧结温度达到250℃,银界面无压烧结焊点的剪切强度达到60 MPa以上;金界面无压烧结焊点在200℃时剪切强度最高,升高温度会导致烧结银与金界面原子扩散过快,界面结合强度降低;铜界面无压烧结焊点由于氧化严重,界面出现裂纹,剪切强度远低于金、银界面焊点的剪切强度。
Using sintering silver paste as an interconnect material for packaging can give full play to the advantages of wide bandgap semiconductors in device applications and improve the reliability of devices. By analyzing the microstructure, mechanical properties and failure modes of the pressureless silver paste sintering joints, the microstructure evolution rule of the pressureless silver paste sintering joints at different temperatures was systematically researched. The influence of sintering temperature and substrate metallization type on the connection performance and reliability of sintered silver was obtained. When the sintering temperature was 250 ℃, the shear strength of the pressureless sintering joints at the silver interface reached more than 60 MPa. The shear strength of the pressureless sintering joints at the gold interface was the highest at 200 ℃. Increasing the temperature would cause the atoms at the interface of sintered silver and gold to diffuse too fast, resulting in a decrease in the bonding strength of the interface. Due to the severe oxidation and the cracks at the interface, the shear strength of pressureless sintering joints at the copper interface was much lower than that of joints at silver and gold interfaces.
作者
吴炜祯
杨帆
胡博
李明雨
WU Weizhen;YANG Fan;HU Bo;LI Mingyu(Shenzhen Xinyuan New Material Co.,Ltd.,Shenzhen,Guangdong 518133,China;Sauvage Laboratory for Smart Materials,Harbin Institute of Technology(Shenzhen),Shenzhen,Guangdong 518055,China)
出处
《机车电传动》
北大核心
2022年第6期149-155,共7页
Electric Drive for Locomotives
基金
国家自然科学基金项目(52075125)。
关键词
烧结银膏
无压烧结
剪切强度
表面金属化
断裂模式
sintering silver paste
pressureless sintering
shear strength
surface metallization
fracture mode
