摘要
介绍了功率模块的现状、封装过程、可靠性及其失效规律,论述了研究模块可靠性的标准试验方法如耐力试验和环境试验,讨论了模块的主要失效机制如键合引线失效、表面金属化重建、焊料疲劳和衬底分层等。
Firstly, the module concept, packaging procedures, reliability and failure rules was presented. Then, the standard tests methodologies for investigating module reliability including endurance and environment tests were discussed. Lastly, the main failure mecha- nisms such as wire bonds failure, chip metallization reconstruction, solder layer fatigue and substrate delamination were studied.
出处
《机车电传动》
北大核心
2013年第1期5-9,共5页
Electric Drive for Locomotives
