摘要
硅溶片工艺用于制造MEMS惯性传感器[1]。能够实现高深宽比、导电性好的微机械结构。我所采用这种工艺制造出多种MEMS器件,包括加速度计和陀螺等。但该工艺用于制造垂直动作结构如Z轴加速度计和开关时,成品率不高。主要失效原因是由于EPW腐蚀工艺、去离子水漂洗和释放工艺中出现“液体桥”而引起的粘连。本文提出一种新型硅溶片工艺来防止上述失效。结果证明可以提高成品率和一致性。
The silicon-dissolved process is used for the fabrication of MEMS inertial sensors .High aspect ratio and high conductivity micro mechanical structures can be realized.A lot of MEMS devices were prepared on this process in our in stitute including accelerometer and gyro.But we found the product yield was poor for vertical resonating structure such as Z-axis ac-celerometer and switch.The main failure reason was demonstrated as adhesion caused by'liquid bridge'which happened in the EPW etching,DI water rinse and release process.We proposed an alternative silicon dissolved process to prevent the adhesion by'liquid bridge'that mentioned above.The improved production yield and uniformity were demonstrated.
出处
《微纳电子技术》
CAS
2002年第12期28-31,35,共5页
Micronanoelectronic Technology
