摘要
阐述电子封装材料的基本要求,论述高硅铝合金材料的研究概况及其性能特点,分析熔炼铸造、浸渗法、快速凝固/粉末冶金和喷射沉积制备方法的优缺点,并指出高硅铝合金电子封装材料的发展方向。
Basic requirements of electronic packaging materials were reviewed, the characteristics and research situation of the high aluminum-silicon alloys were discussed, and the advantages and disadvantages of the preparation processes that include casting, infiltration, rapid solidification powder metallurgy and spray-forming were analyzed. Moreover, the development tendency of high aluminum-silicon alloy electronic packaging materials was pointed out.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2012年第9期2578-2587,共10页
The Chinese Journal of Nonferrous Metals
基金
国家军品配套项目(JPPT-125-GH-039)
关键词
高硅铝合金
电子封装
性能
熔炼铸造
浸渗法
喷射沉积
high silicon aluminum alloy
electronic packaging
casting
infiltration
spray-forming
