摘要
本文基于红外热成像技术在小型微电路模块中的应用,采取提高温度阈值、半导体制冷降温、合理电激励等方式改善了红外热成像失效定位效果,提升了失效定位效率,对于微电路模块失效分析工作有实践指导意义。
This article is based on the application of infrared thermal imaging technology in small microcircuit modules,and adopts methods such as increasing the temperature threshold,semiconductor cooling and reasonable electrical excitation to improve the failure location effect of infrared thermal imaging and improve the failure location efficiency.For microcircuit modules the failure analysis work has practical guiding significance.
作者
冯慧
尹丽晶
范士海
FENG Hui;YIN Li-Jing;FAN Shi-hai(Aerosape Science&Industry CORP Defense Technology R&T Cente,Beijing 100854;The 13th Research Institute of China Electronics Technology Group Corporation,Shijiazhuang 050000)
出处
《环境技术》
2020年第6期119-123,共5页
Environmental Technology
关键词
微电路模块
红外热成像
失效定位
microcircuit module
infrared thermal imaging
failure location
