摘要
金丝球焊键合工艺作为主要的内部引线互连工艺技术 ,广泛应用于单片集成电路 ( IC)及厚薄膜混合集成电路 ( HIC)中。在批量生产中 ,其键合质量直接影响产品的可靠性 ,文章探讨了在批量生产中如何使用质量统计控制方法对金丝球焊键合工艺进行及时有效的调整控制 ,使其在批量生产中的质量一致性满足产品质量可靠性要求 。
As one of major technologies for wire interconnections, the golden wire ball soldering bonding has been widely used for monolithic IC's and thick film hybrid IC's In mass production, the quality of bonding directly affects the reliability of the product The use of statistical quality control method in mass production to effectively adjust and control the bonding process of golden wire ball soldering is described in the paper Using this method, quality consistency in mass production is obtained, which ensures the reliability of the product, and also output and efficiency are improved
出处
《微电子学》
CAS
CSCD
北大核心
2002年第3期198-201,共4页
Microelectronics
