摘要
通过对化学镀锡液组成的调试和完善 ,研究了新的工艺配方中工艺条件对沉积速度和镀层中锡含量的影响 ,优化了化学镀锡的最佳工艺。此外 ,试验结果表明 :次亚磷酸钠对反应动力学有积极的促进作用 ,能明显提高锡的化学沉积速度 ;镀液中没有络合剂时 ,化学反应不能进行 ;添加剂B和添加剂C均能细化晶粒 。
The effects of process conditions on deposition rate and tin content of the coatings are studied by adjusting and improving the bath compositions so that the process conditions of electroless tin plating are optimized. The experimental results also show that NaH 2PO 2 in the bath has a positive role in promoting reaction dynamics, and can greatly enhance the deposition rate of electroless tin; the chemical reaction cannot occur without complexing agent in bath. Both additive B and C can make crystals finer, but the deposition rate will decrease with the increasing of their concentrations.
出处
《电镀与环保》
CAS
CSCD
2002年第5期13-16,共4页
Electroplating & Pollution Control
关键词
化学镀
优化
镀锡
沉积速度
工艺条件
Electroless tin plating
Deposition rate
Process condition
