摘要
对轧制复合的Ag Cu双金属薄板采用不同温度的退火处理 ,研究了结合面分离强度随退火温度变化的规律 ,讨论了影响分离强度的因素。结果表明 ,在 40 0℃以下随退火温度的升高 ,由于原子扩散及再结晶晶界的形成趋于充分而导致分离强度升高 ,40 0℃时分离强度达到最大值。当退火温度超过 40 0℃后 ,由于结合面的异类原子不等量对流而导致结合面形成空洞 ,从而使分离强度下降。 750℃退火时分离强度达到最低值。退火温度进一步上升到 80 0℃时可使结合面发生局部熔合 。
The Ag/Cu bimetallic strips bonded by roll process were annealed at different temperatures. The effect of annealing temperature on the peeling strength was investigated and the mechanism responsible for the peeling strength various with annealing temperature was discussed. The peeling strength increases with annealing temperature because of the diffusion of atoms across through the bonding interface and the formation of grain boundaries from recrystallization. The bimetallic strips annealed at 400℃ display high peeling strength. There exist some cavities at the bounding interface to result in reduction of the peeling strength when annealing temperature is further elevated. The peeling strength could slightly be improved if the bimetallic strips are annealed at sintering temperature.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2002年第3期31-34,共4页
Transactions of Materials and Heat Treatment
基金
云南省省校科技合作基金 ( 98YZ - 0 0 2 )
