摘要
对Cu/Mo/Cu板材进行了单道次复合轧制,研究了退火温度对Cu/Mo/Cu复合板微观组织和力学性能的影响。结果表明:退火温度对铜板的微观组织影响较大。随着退火温度的升高,复合界面处的细小晶粒分布趋于均匀;当温度高于400℃时,铜晶粒发生再结晶长大,组织粗化。随着退火温度的升高,复合板的结合强度逐渐升高;400℃时达到最大值76 MPa;温度继续升高时,结合强度迅速下降。复合机制主要为裂口结合机制。
The single-pass composite rolling was conducted on the Cu/Mo/Cu laminates.The effect of the annealing temperature on the microstructure and mechanical properties of the laminates was studied.The results showed that the annealing temperature had a significant effect on the microstructure of the copper plates.The fine grains distributed at the interface were more uniform with the increase of the annealing temperature.When the annealing temperature was up to 400 ℃,the microstructure of the copper was coarse du...
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2010年第3期460-463,共4页
Chinese Journal of Rare Metals
基金
陕西省"13115"科技创新工程重大专项(2008ZDKG-41)资助项目
