摘要
主要研究汽车在行驶中发动机发热和芯片自身发热对车载电路板组件产生的影响。运用有限元软件ANSYS对发动机模块电路板建模,分别施加芯片自身发热、发动机工作温度以及两者共同作用三种情形下的热载荷,进行温度场热应力分析,比较三种情况下的温度场分布和热变形情况。结果显示:在实际车载工作环境中,发动机发热是车载电路板产生热变形的主要因素。电路板组件中最大离面位移出现在电路板中间一带芯片处,上述芯片位置是电路板组件在芯片和发动机共同发热条件下的最危险区域。
In order to study the influence of thermal produced by engine and chips to the PCB assembly in the vehicle under the driving car, the PCB in vehicle was taken as a study object by ANSYS. The the temperature field analysis and thermal stress analysis was carried out under the -thermal produced by chips, by engine and the both- three different thermal Ioadings. Comparing the distribution of temperature and thermal deformation under three different thermal loadings, the details of the PCB assembly can be obtained. The results showed that the thermal produced by engine played the major role in the thermal deformation of the PCB assembly under the working condition of the car. The maximum displacement of out-of-plane appeared the areas located on the PCB center. These areas of the chips were the most dangerous on the PCB assembly.
出处
《武汉纺织大学学报》
2017年第6期76-80,共5页
Journal of Wuhan Textile University
基金
湖北省教育厅科学研究计划青年人才项目(No.Q20141608)
国家自然科学基金青年项目(No.11102141)
关键词
车载电路板
热载荷
芯片
热应力
PCB Assembly in vehicle
thermal loading
chips
thermal stress
