摘要
机载电子设备结构复杂,工作环境恶劣,电子设备的温度变化会产生热应变,由于部件材料的热膨胀系数不同及相互间的约束导致各部件热应力不匹配会造成器件的失效。研究电子设备热力耦合仿真分析方法,对提高电子设备可靠性具有重要意义。针对机载电子设备模块建立了热力耦合仿真模型,进行了热力耦合仿真分析,并通过实验测试进行了验证,为今后分析机载电子设备的热失效机制、优化其结构、提高焊点等热敏部位的可靠性提供了有效的方法。
The structure of airborne electronics equipment is complex and the working environment is harsh. When the temper-ature of electronics equipment changed, the component failure was caused by thermal stress due to different thermal expansion coefficient of different material. The research of thermo-mechanical coupling simulation analysis method is important to im-prove reliability of electronics equipment. Thermo-mechanical coupling simulation model aiming at electronics equipment module is established in this paper. Thermo-mechanical coupling simulation analysis is built and the simulation method is val-idated by experiment test which provides effective methods to analyze thermal failure mechanism of electronics module, opti-mize its structure and advance reliability of thermal sensitive position such as spot weld in future.
出处
《机械研究与应用》
2016年第2期31-32,共2页
Mechanical Research & Application
基金
航空科学基金资助(编号:20100231001)
关键词
机载电子设备
热力耦合
仿真分析
模型
airborne electronics equipment
thermo-mechanical coupling
simulation analysis
model
