摘要
在高速PCB设计中,信号完整性问题是不可避免的。而借助于仿真工具参与PCB的设计可以极大提高产品一次成功率。本文简要阐述了信号完整性的反射、串扰及电源完整性问题,借助于Allegro PCB SI GXL、Allegro PCB PI option XL及Sig Xplorer仿真组件对高速AD/DA系统应用实例进行了定量仿真与分析,验证了常见SI问题的正确性,提出了优化PCB设计的解决方案。
The problem of signal integrity cannot be avoided in high-speed PCB design. The simulation tools can help us to get much higher one-through design success. The article analyzes series of signal integrity problems, such as reflection, crosstalk and power integrity. By means of Allegro PCB SI GXL, Allegro PCB PI option XL and Sig Xplorer, SI simulations for highspeed PCB system are designed. Common SI problems are validated, and proposed solutions to optimize PCB design.
出处
《电子设计工程》
2016年第6期67-70,共4页
Electronic Design Engineering
