摘要
为了解决高速多层PCB的电源完整性问题,缩短其开发周期,提高其工作性能,以ARM11核心系统为例,提出利用Cadence PI对PCB进行电源完整性分析的方法。通过对电源系统目标阻抗分析,确定去耦电容的数值,数量以及布局;对电源平面进行直流压降和电流密度分析,改善PCB设计,优化系统的电源完整性。利用动态电子负载搭建的测试平台,对电源仿真分析后制作的PCB进行测试,系统电源完整性较好,表明分析的结果是有效的。
In order to solve the problem of the integrity of the power supply of high speed multilayer PCB,shorten the development period and improve its working performance,this paper puts up with the analytical method of PCB power integrity based on the ARM 11 core system,using Cadence PI.The decoupling capacitor parameter,quantity and corresponding layout can be determined by analyzing the target impedance of the power system.It is possible to improve the PCB design,optimize the power integrity of the system by analyzing the DC power drop and ampere density of the power plane.The test of the PCB,which is made after the power supply simulation using the dynamic electronic load test platform,reveals the the analysis is effective.
出处
《电子设计工程》
2014年第3期153-155,160,共4页
Electronic Design Engineering
