期刊文献+

热像设备模数混合电路公共阻抗干扰的研究 被引量:1

Common impedance interference in mixed signal circuit of infrared equipment
在线阅读 下载PDF
导出
摘要 随着红外成像技术的发展,大面阵探测器、高集成度处理电路、高帧频红外图像等特点给模拟电路的设计带来了很多困难,其中模数混合电路的干扰问题尤为突出。在建立电路模型的基础上对模拟前级的干扰问题形成原因进行了分析,依据分析结果改进设计模拟前级,经过验证,减小了模拟前级信号受到的干扰。 With the development of infrared imaging technology,the characteristics of large infrared FPA,high frame speed of inferred image,large scale integration of circuits introduce some difficulties in the design of analog input stage,especially the interference.This paper analyzes how interference is generated from the point of Abstraction circuit model,and improves the design of analog input stage based on the result of analysis.The interference in new analog input stage has been reduced to a great degree.
出处 《激光与红外》 CAS CSCD 北大核心 2013年第4期442-446,共5页 Laser & Infrared
关键词 干扰 信噪比 公共阻抗 模拟前级 interference SNR common impedance analog input stage
  • 相关文献

参考文献6

  • 1刘会通,易新建,刘靖,徐隆.红外焦平面阵列基于黑体的非均匀性校正方法中的限制因素[J].红外技术,2003,25(3):41-44. 被引量:11
  • 2路宏敏,梁昌洪,朱满座.导体阻抗的频率特性[J].安全与电磁兼容,2002(6):41-42. 被引量:3
  • 3T Sudo, H Sasaki, N Masuda. Electromagnetic interference (EMI) of system-on-package (SOP) [ J ]. IEEE Transac- tions on Advanced Packaging. May, 2004, 27 ( 2 ) : 304 -314.
  • 4Howard Johnson, Martin Graham. High-Speed digital de- sign : a handbook of black magic [ M ]. New Jersey : Pren- tice Hall, 1995.
  • 5申伟,唐万明,王杨.高速PCB的电源完整性分析[J].现代电子技术,2009,32(24):213-218. 被引量:18
  • 6Aida Todri, Malgorzata Marek-Sadowska, Francois Maire, et al. A study of decoupling capacitor effectiveness in power and ground grid networks [ C ]. Isqed 2009: Pro- ceedings 10th International Symposium on Quality Elec- tronic Design, New York, IEEE ,2009,1 - 2:653 - 658.

二级参考文献26

  • 1Howard Jonson.高速数字设计[M].北京:电子工业出版社,2006.
  • 2王守三.PCB的电磁兼容设计、技巧和工艺[M].北京:机械工业出版社,2008.
  • 3王成华,王友仁,胡志忠.电子线路基础教程[M].北京:科学出版社.2003.
  • 4顾海州,马双武.PCB电磁兼容技术[M].北京:清华大学出版社.2004.
  • 5Dougl Brooks.信号完整性问题和印制电路板设计[M].北京:机械工业出版社,2005.
  • 6[1]Ralph Morrison, Grounding and Shielding Techniques.New York: John Wiley & Sons, Inc., 1998.
  • 7[2]V. Prasad Kodali, Engineering Electromagnetic Compatibility: Principles, Measurements, and Technologies. New York: IEEE Press, 1996.
  • 8[3]Clayton R. Paul, Introduction to Electromagnetic Compatibility. New York: John Wiley & Sons, Inc., 1992.
  • 9[4]Anthony N. St. John, "Grounds for signal referencing,"IEEE Transactions on Spectrum, pp. 42 ~ 45, June 1992.
  • 10[5]Daryl Gerke, PE, "Mysteries of Grounding," Phoenix EMC Society Chapter, May 2002.

共引文献29

同被引文献286

引证文献1

二级引证文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部