摘要
近年来,高密度级LED制作而成的显示屏成为显示屏行业中发展比较迅速的热门产品。高密度级的LED的外形尺寸越来越小,性能越来越高,势必对贴装工艺和电路设计有更高的要求。本文提出了一种新型LED封装方式。该方式可有效地解决LED的贴装和散热困难等一系列问题。
In recent decades, the LED display fabricated by high-density level LEDs have developed rapidly and become one of popular products. The fact, that dimensions of high-density level LEDs become smaller and performances become better, results in higher requirements of associated mounting technology and circuit designs. This paper presents a novelty LED packaging method. This packaging method can effectively solve difficulties of mounting and dissipating of Joule heat, and other special issues.
出处
《电子世界》
2015年第20期141-142,共2页
Electronics World
基金
国家863项目(2013AA03A107)
福建省产学研重大科技项目(2013H6024)
关键词
高密度级LED
封装
散热
High-density level LED
packaging method
heat dissipation
