摘要
近年来高密度LED显示屏发展迅速,LED显示屏点间距不断缩小甚至达到P0.X级别,这对LED产业链上中下游提出了一些新的要求和挑战。本文从高密度LED显示屏应用的需求和趋势出发,探讨了其对LED芯片的要求,提出了一些需要格外关注的LED芯片特性。
Recently, with the rapid development of high pixel-density LED display screen, the pixel pitch of LED display appeared significant reduce even below 1.0 mm, which brought some new requirements and challenges to LED industry chain. On this paper, we discussed the requirements of LED chips for the high pixel-density LED display application, and listed some characteristics of LED chips which needed to be particularly cared in this application.
出处
《电子科学技术》
2014年第3期350-353,共4页
Electronic Science & Technology
