摘要
通过对近年来国内外IGBT热阻测量技术进行分析,根据各方法测量原理不同归类为四种方法:热敏参数法、数学物理法、实测结温法、红外扫描法。描述了近年来热阻测量的不断改进之处,并总结了各测量方法的优缺点。最后分析了热阻测量的发展趋势和所需解决的关键问题。
The thermal resistance measuring methods of IGBT are analyzed which published in domestic and abroad in recent years. According to the measuring principle, methods are classified into four： thermal sensitive parameters method, mathematical physics method, the directly measure junction temperature method and the infrared scanning method. The continuous improvements of the thermal resistance measurements in recent years are described, as well as their advantages and disadvantages. At last, the trends of measurement and the key issues which should be solved are pointed out.
出处
《电子元件与材料》
CAS
CSCD
2015年第9期25-30,共6页
Electronic Components And Materials
基金
国家自然科学基金资助(No.51377044)
河北省科技支撑计划资助项目(No.13214303D
No.14214503D)
关键词
IGBT
热阻
综述
结温
温度测量
对比分析
IGBT
thermal resistance
review
junction temperature
temperature measurement
comparative analysis
