摘要
绝缘栅双极型晶体管(简称IGBT)等全控型电力电子器件是电能变换装置的核心部件,由于电力电子器件的工作性能与可靠性等都与其工作结温直接相关,而电力电子器件的热阻抗直接影响器件的结温,开展以IGBT热阻网络为对象的传热特性研究对于延长IGBT的使用寿命和提高其应用可靠性具有很重要的现实意义。为此,概述了IGBT物理结构、热阻网络及提取动态热阻抗曲线测试原理、传热模型3种建模方法及各方法的优劣。以某型IGBT模块为研究对象,通过理论计算得到其各分层及模块结壳稳态热阻值,建立了Cauer热网络模型,并在数值仿真软件ANSYS热仿真分析环境下利用有限元法(FEM)建立了数值仿真模型,利用搭建的试验平台开展了提取动态热阻抗实验,建立了7阶Foster实验测定模型。数值仿真和实验测定所得到的稳态结壳热阻值与理论计算模型接近,并对偏差进行了分析。建模研究IGBT传热模型对该类电力电子器件热传递模型建模研究及散热设计具有一定的指导意义。
The full-controlled power electronic devices,such as IGBT,are essential components of electrical energy transform equipment.Consequently,the physical structure and the conception,RC component network of thermal resistance,test principle and extraction platform for the transient thermal impedance of IGBT module,and three modeling methods are briefly introduced.The advantages and disadvantages of three modeling methods are also discussed.Moreover,the Cauer RC compact thermal component network model of a certain type IGBT is deduced from theoretical calculation.The junction-case thermal resistance can be derived by the finite element method in the numerical simulator ANSYS and the extraction of the transient thermal impedance curve.Thermal compact component network model can be derived from the numerical simulation and experimental results.The calculation,numerical simulation and experimental results are similar to each other.The thermal compact model and experimental results could be helpful for the modeling of thermal model and heat sink design for such electronic devices.
出处
《高电压技术》
EI
CAS
CSCD
北大核心
2011年第2期453-459,共7页
High Voltage Engineering
基金
国家自然科学基金(50737004)
国家自然科学基金委员会创新研究群体科学基金(50721063)~~
关键词
绝缘栅双极型晶体管
热模型
热阻
动态热阻抗
结温
RC热网络
壳温
数值仿真
有限元法
insulated gate bipolar translator（IGBT）
thermal model
thermal resistance
transient thermal impedance
junction temperature
RC thermal network model
case temperature
numerical simulation
finite element method
