摘要
论文针对计算机芯片的散热问题进行了研究,提出了一种采用微通道结构的散热系统设计方案,用热分析软件对微通道结构进行了数值仿真,并且指导了实验装置的设计。
The heat dissipation of computer chip is studied in this paper. A new concept using micro-channel structure is suggested and the performance of the micro-channel structure is analyzed using the FEA (finite element analysis) software. The design of experimental device is guided by it.
出处
《电子机械工程》
2005年第3期15-17,21,共4页
Electro-Mechanical Engineering
基金
国防科技预研基金项目(51416050201D20139)
