摘要
硅-硅直接键合技术广泛应用于SOI、MEMS和电力电子器件工艺中,衬底抛光片的质量对键合质量及器件性能起着至关重要的影响。衬底抛光片的质量包含几何尺寸精度及表面状态质量,会影响键合过程中的界面应力,或造成键合界面空洞的产生,从而影响键合质量。
The Silicon-silicon Direct Bonding（SDB）technology has been widely used in SOI,MEMS and electron-ics. In the technique,the quality of a polished silicon wafer substrate exerts an important impact on both bonding effect and device performance. Consisting of dimensional accuracy and surface quality,the substrate quality will determine the bonding effect through influencing the interfacial stress or introducing interfacial cavities.
出处
《天津科技》
2014年第11期18-19,21,共3页
Tianjin Science & Technology
关键词
硅片
抛光片
硅硅键合
键合质量
silicon wafer
polished wafer
silicon-silicon direct bonding
bonding quality
