摘要
采用热压法进行氮化硅陶瓷材料的扩散连接。结果表明 :在 15 2 0℃ ,15MPa ,6 0min条件下 ,氮化硅连接体的最高强度为 4 4 8.6MPa ,超过母材强度 ;平均连接强度为 4 0 1.5MPa ,为母材强度的96 %。
The diffusion bonding of silicon nitride was carried out by hot pressing method,and its mechanical properties of the joints were discusssed here.An optimum bonding strength could be gained with suitable parameters, such as pressure,temperature and time.The maximum bonding strength at room temperature was 448.6MPa(1520℃,15MPa,60min),which exceeded the average flexureal strength of the original body.And the average bonding strength at this condition was 401.5MPa,which was about 96% of the average flexural strength of the original body.
出处
《硅酸盐通报》
CAS
CSCD
2002年第3期18-21,共4页
Bulletin of the Chinese Ceramic Society
基金
国家教育部重点科学资助项目
